High pressure ammonia nitridation of tunnel oxide for 3dnand applications

ABSTRACT

Embodiments disclosed herein generally related to system for forming a semiconductor structure. The processing chamber includes a chamber body, a substrate support device, a quartz envelope, one or more heating devices, a gas injection assembly, and a pump device. The chamber body defines an interior volume. The substrate support device is configured to support one or more substrates during processing. The quartz envelope is disposed in the processing chamber. The quartz envelope is configured to house the substrate support device. The heating devices are disposed about the quartz envelope. The gas injection assembly is coupled to the processing chamber. The gas injection assembly is configured to provide an NH 3  gas to the interior volume of the processing chamber. The pump device is coupled to the processing chamber. The pump device is configured to maintain the processing chamber at a pressure of at least 10 atm.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority from U.S. Provisional Application Ser.No. 62/343,919, filed Jun. 1, 2016, which is hereby incorporated byreference in its entirety.

BACKGROUND Field

Embodiments disclosed herein generally related to system for forming asemiconductor structure, and a method of doing the same.

Description of the Related Art

As the structure size of integrated circuit (IC) devices is scaled downto sub-quarter micron dimensions, electrical resistance, and currentdensities have become an area for concern and improvement. Multilevelinterconnect technology provides the conductive paths throughout an ICdevice, and are formed in high aspect ratio features including contacts,plugs, vias, lines, wires, and other features. A typical method forforming an interconnect on a substrate includes depositing one or morelayers, etching at least one of the layer(s) to form one or morefeatures, depositing a barrier layer in the feature(s), and depositingone or more layers to fill the feature. Typically, a feature (or via) isformed in an oxide material disposed on a substrate.

Plasma nitridation has been used to nitride (i.e., incorporate nitrogeninto) the oxide layer. This technique results in high nitrogenconcentration on a surface of the oxide layer. As the demand for higheraspect ratios increase, it becomes increasingly more difficult tonitride the oxide layer. This is due to a combination of the averagelifetime of the nitrogen compounds used in conventional nitridationprocesses, and the depth of the features in higher aspect ratios.Conventional processes are unable to adequately nitride the entirefeature formed in the oxide layer.

Thus, an improved processing chamber and method for forming asemiconductor structure are needed.

SUMMARY

Embodiments disclosed herein generally related to system for forming asemiconductor structure. The processing chamber includes a chamber body,a substrate support device, a quartz envelope, one or more heatingdevices, a gas injection assembly, and a pump device. The chamber bodydefines an interior volume. The substrate support device is configuredto support one or more substrates during processing. The quartz envelopeis disposed in the processing chamber. The quartz envelope is configuredto house the substrate support device. The heating devices are disposedabout the quartz envelope. The gas injection assembly is coupled to theprocessing chamber. The gas injection assembly is configured to providean NH3 gas to the interior volume of the processing chamber. The pumpdevice is coupled to the processing chamber. The pump device isconfigured to maintain the processing chamber at a pressure of at least10 atm.

In another embodiment, a system for forming a semiconductor structure isdisclosed herein. The system includes a transfer chamber and a pluralityof processing chambers. The plurality of processing chambers is coupledto the transfer chamber. At least one of the plurality of processingchambers includes a chamber body, a substrate support device, a quartzenvelope, one or more heating devices, a gas injection assembly, and apump device. The chamber body defines an interior volume. The substratesupport device is configured to support one or more substrates duringprocessing. The quartz envelope is disposed in the processing chamber.The quartz envelope is configured to house the substrate support device.The heating devices are disposed about the quartz envelope. The gasinjection assembly is coupled to the processing chamber. The gasinjection assembly is configured to provide an NH3 gas to the interiorvolume of the processing chamber. The pump device is coupled to theprocessing chamber. The pump device is configured to maintain theprocessing chamber at a pressure of at least 10 atm.

In another embodiment, a method of forming a semiconductor structure ona substrate is formed herein. An oxide layer is formed on the surface ofthe substrate. A via is formed in the oxide layer. The via extends atleast partially into the oxide layer. The oxide layer is exposed to NH3.The chamber pressure is maintained at a pressure of at least 10 atmwhile the oxide layer is exposed to NH3.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the presentdisclosure can be understood in detail, a more particular description ofthe disclosure, briefly summarized above, may be had by reference toembodiments, some of which are illustrated in the appended drawings. Itis to be noted, however, that the appended drawings illustrate onlytypical embodiments of this disclosure and are therefore not to beconsidered limiting of its scope, for the disclosure may admit to otherequally effective embodiments.

FIG. 1 is a schematic view of an integrated tool 100 for processingsemiconductor substrates in which embodiments of the disclosure may bepracticed.

FIG. 2 is a cross-sectional view of a plasma nitridation chamber,according to one embodiment.

FIG. 3 is a flow diagram that illustrates a method of forming asemiconductor device, according to one embodiment.

FIGS. 4A-4C illustrate cross-sectional views of a substrate at differentstages of the method of FIG. 3.

For clarity, identical reference numerals have been used, whereapplicable, to designate identical elements that are common betweenfigures. Additionally, elements of one embodiment may be advantageouslyadapted for utilization in other embodiments described herein.

DETAILED DESCRIPTION

FIG. 1 is a schematic view of an integrated tool 100 for processingsemiconductor substrates in which embodiments of the disclosure may bepracticed. Examples of suitable integrated tools include the CENTURA®and ENDURA® integrated tools, all available from Applied Materials, Inc.of Santa Clara, Calif. It is contemplated that the methods describedherein may be practiced in other tools having the requisite processchambers coupled thereto, including those from other manufacturers.

The integrated processing tool 100 includes a vacuum-tight processingplatform 101, a factory interface 104, and a system controller 102. Theplatform 101 has a plurality of processing chambers 114A-114D andloadlock chambers 106A-106B that are coupled to a vacuum substratetransfer chamber 103. The factory interface 104 is coupled to thetransfer chamber 103 by the loadlock chambers 106A-106B.

In one embodiment, the factory interface 104 includes at least onedocking station 107 and at least one factory interface robot 138. Thedocking station 107 is configured to accept one or more front openingunified pods (FOUPs). Four FOUPs 105A-105D are shown in the embodimentof FIG. 1. The factory interface robot 138 is configured to transfersubstrates in the factory interface 104 between the FOUPs 105A-105D andthe loadlock chambers 106A-106B.

The loadlock chambers 106A-106B have a first port coupled to the factoryinterface 104 and a second port coupled to the transfer chamber 103. Theloadlock chambers 106A-106B are coupled to a pressure control system(not shown) which pumps down and vents the chambers 106A-106B tofacilitate passing the substrate between the vacuum environment of thetransfer chamber 103 and the substantially ambient (e.g., atmospheric)environment of the factory interface,

The transfer chamber 103 has a vacuum robot 113 disposed therein. Thevacuum robot 113 is capable of transferring substrates 121 between theloadlock chamber 106A-106B and the processing chambers 114A-114D.

In one embodiment, the processing chambers coupled to the transferchamber 103 may be a chemical vapor deposition (CVD) chamber 114D, aplasma nitridation chamber 114C, a rapid thermal process (RTP) chamber114B, or an atomic layer deposition (ALD) chamber 114A. The particularchambers shown coupled to the transfer chamber 103 are examples ofchambers that may be coupled to the transfer chamber 103. Alternatively,different processing chambers, including at least one of ALD, CVD, metalorganic chemical vapor deposition (MOCVD), physical vapor deposition(PVD), plasma nitridation, or RTP chambers may be interchangeablyincorporated into the integrated processing tool 100 in accordance withprocess requirements.

The system controller 102 is coupled to the integrated processing tool100. The system controller 102 controls the operation of the integratedprocessing tool 100 by direct control of the processing chambers114A-114D of the integrated processing tool 100, or alternatively, bycontrolling the computers (or controllers) associated with theprocessing chambers 114A-114D of the integrated processing tool 100. Inoperation, the system controller 102 enables data collection andfeedback from the respective chambers and system to optimize performanceof the integrated processing tool 100.

The system controller 102 generally includes a central processing unit(CPU) 130, memory 136, and support circuit 132. The CPU 130 may be oneof any form of a general purpose computer processor that can be used inan industrial setting. The support circuits 132 are conventionallycoupled to the CPU 130 and may comprise cache, clock circuits,input/output subsystems, power supplies, and the like. The softwareroutines when executed by the CPU 130 transform the CPU into a specificpurpose computer (controller) and enable processes, such as the methoddescribed in conjunction with FIG. 3, to be performed on the integratedprocessing tool 100. The software routines may also be stored and/orexecuted by a second controller (not shown) that is located remotelyfrom the integrated processing tool 100.

FIG. 2 is a cross-sectional view of a plasma nitridation chamber 114Caccording to one embodiment. The plasma nitridation chamber 114Cincludes a chamber body 202 defining an interior volume 204. The plasmanitridation chamber 114C further includes a quartz envelope 206. Thequartz envelope 206 is configured to house a substrate support device208. The substrate support device 208 is configured to support one ormore substrates 201 in the plasma nitridation chamber 114C. In theembodiment shown in FIG. 2, the substrate support device 208 isconfigured to support one or more substrates 201 in a verticalorientation in the quartz envelope 206.

The plasma nitridation chamber 114C further includes a plurality ofheating elements 210. The plurality of heating elements 210 ispositioned about the quartz envelope 206. The plurality of heatingelements 210 is configured to heat the quartz envelope 206 to a desiredtemperature. For example, the plurality of heating elements 210 may heatthe quartz envelope 206 to a temperature between 600° C. and 1,200° C.

The plasma nitridation chamber 114C may further include a gas injectionassembly 212 coupled to a gas source 216, a pump device 214, and anexhaust assembly 218. The gas injection assembly 212 is configured toprovide a gas to the interior volume 204 of the chamber 114C. In oneembodiment, the gas source 216 is configured to provide NH3 gas to theinterior volume 204 and inside the quartz envelope 206, such that thenitridation rate of the one or more substrates 201 is increased. The NH₃gas may be provided, in neat (i.e. 100%), concentrated (i.e. 50% up to100%), or dilute (i.e. <50%) form, at a flow rate of 1 sLm to 20 sLm,for example 10 sLm. The pump device 214 is coupled to the nitridationchamber 114C, in communication with the interior volume 204. The pumpdevice 214 is configured to control a pressure of the interior volume204 of the chamber 114C. For example, the pump device 214 is configuredto maintain a pressure of between 10-20 atmospheres (atm) while the gasinjection assembly 212 provides NH₃ gas to the interior volume 204. Theexhaust assembly 218 may be disposed on an opposite side of the chamber114C from the gas injection assembly 212. The exhaust assembly 218 isconfigured to remove the NH₃ gas from the chamber 114C.

The plasma nitridation chamber 114C may further include a temperaturecontrol device 220. The temperature control device 220 is configured tocontrol a temperature of the chamber body 202 of the chamber 114C duringprocessing. In one embodiment, the temperature control device may be inthe form of thermal shield plates coupled to the chamber body 202. Inthe embodiment illustrated in FIG. 1, the temperature control device 220is in the form of a cooling channel 222 formed in the chamber body 202.The cooling channel 222 is configured to flow a heat transfer fluidthrough the chamber body 202, to control the temperature of the chamberbody 202 during processing.

FIG. 3 is a flow diagram that illustrates a method 300 of forming asemiconductor device 400, according to one embodiment. FIGS. 4A-4Dillustrate cross-sectional views of a substrate 401 at different stagesof the method 300 of FIG. 3. FIG. 4A depicts the substrate 401 withoutany layers deposited thereon. The method 300 begins at block 302. Atblock 302, an oxide layer 402 is formed on the substrate 401. In oneembodiment, the oxide layer 402 may be formed from SiO₂. The oxide layer402 may be formed on the substrate 401 in a process chamber such as oneof the processing chambers 114A-114D in FIG. 1. For example, the oxidelayer 402 may be formed in the RADIANCE® system, available from AppliedMaterials, Inc. The oxide layer 402 may be deposited on the substrate401 through CVD, rapid thermal-CVD (RT-CVD), plasma enhanced-CVD(PECVD), physical vapor deposition (PVD), ALD, or combinations thereof.In one embodiment, the oxide layer 402 may have a thickness betweenabout 1.5 nm to about 3 nm.

At block 304, a via 404 is formed in the Oxide layer 402, as shown inFIG. 4C. The via 404 may extend partially into the Oxide layer 402, froma top surface 406 of the Oxide layer.

At block 306, the substrate 401 having the Oxide layer 402 depositedthereon, is transferred to a plasma nitridation chamber, such as theplasma nitridation chamber 114C, to undergo a nitridation process.During the nitridation process, the oxygen on the surface of the oxidelayer 402 is replaced by nitrogen. In one embodiment, about 40% of theoxygen in the oxide layer 402 is replaced with nitrogen. Conventionally,NH₂ and NH have been used for nitridation processes. Due to the higherelectronegativity of oxygen compared to nitrogen, highly reactivespecies are typically used to displace oxygen in such processes. N*,NH₂, and NH have however proven to be too unstable to live long enoughto travel down the high aspect ratio features in the Oxide layer andconformally nitride the feature. To penetrate to the bottom of suchfeatures at concentrations that support conformal nitridation, thenitriding species need to survive one or more wall contact eventswithout sticking, reacting, or extinguishing. Reduced reactivityspecies, or species having lower sticking coefficient, are needed. NH₂and NH may quickly relax back to N₂ and H₂ when they react with theoxide, resulting in a short residence time in the via 404. For example,the average lifetime of NH₂ and NH may be about 10 ms. Additionally, itis difficult to lower reactivity and yet still have sufficient energy tonitride the oxide. By substituting NH₃ for NH and NH₂, the conformalnitridation process with a high temperature NH₃ is driven by the partialpressure of NH3, and enhances the nitridation process. It has been foundthat while increases in processing temperature and processing timeincrease the number of nitrogen atoms in NH₃ incrementally, the increasein pressure, particularly the increase in partial pressure, of NH3during processing increases the number of nitrogen atoms at a greaterrate.

At block 306, the substrate is exposed to NH₃, as shown in FIG. 4D. Thereaction of NH₃ and SiO₂ yields:

NH₃*+SiO₂→SiON+H₂O

The temperature needed to drive the reaction forward is at least 600° C.In one embodiment, the temperature is about 1000° C. The NH3 is providedto the substrate at a flow rate of about 1 sLm to 20 sLm, for example 10sLm. As noted above, the NH3 may be provided in neat, concentrated, ordilute form. The NH₃ is configured to travel to a bottom 408 of the via404.

At block 308, the processing chamber is maintained at a pressure of atleast 10 atm while the substrate is exposed to NH₃. In one embodiment,the pressure of the processing chamber is maintained at a pressurebetween 10 atm and 20 atm.

While the foregoing is directed to specific embodiments, other andfurther embodiments may be devised without departing from the basicscope thereof, and the scope thereof is determined by the claims thatfollow.

What is claimed is:
 1. A processing chamber, comprising: a chamber bodydefining an interior volume; a substrate support device configured tosupport one or more substrates during processing; a quartz envelopedisposed in the processing chamber, the quartz envelop configured tohouse the substrate support device; one or more heating devices disposedabout the quartz envelope; a gas injection assembly coupled to theprocessing chamber, the gas injection assembly configured to provide anNH3 gas to the interior volume of the processing chamber; and a pumpdevice coupled to the processing chamber, the pump device configured tomaintain the processing chamber at a pressure of at least 10 atm.
 2. Theprocessing chamber of claim 1, wherein the pump device is configured tomaintain the processing chamber at a pressure between about 10 atm and20 atm.
 3. The processing chamber of claim 1, further comprising: atemperature control device configured to control a temperature of thechamber body.
 4. The processing chamber of claim 3, wherein thetemperature control device is a cooling channel formed in the chamberbody, the cooling channel configured to flow a heating transfer fluidthrough the chamber body.
 5. The processing chamber of claim 1, furthercomprising: a single chamber door located at an end of the processingchamber, configured to provide ingress and egress for the substratesupport device.
 6. The processing chamber of claim 1, wherein the gasinjection assembly supplies the NH3 gas to an interior volume of thequartz envelope.
 7. The processing chamber of claim 1, wherein the oneor more substrates include a silicon dioxide (SiO2) layer formedthereon.
 8. A system for processing a substrate, comprising: a transferchamber; and a plurality of processing chambers coupled to the transferchamber, wherein at least one of the plurality of processing chamberscomprises: a chamber body defining an interior volume; a substratesupport device configured to support one or more substrates duringprocessing; a quartz envelope disposed in the processing chamber, thequartz envelop configured to house the substrate support device; one ormore heating devices disposed about the quartz envelope; a gas injectionassembly coupled to the processing chamber, the gas injection assemblyconfigured to provide an NH₃ gas to the interior volume of theprocessing chamber; and a pump device coupled to the processing chamber,the pump device configured to maintain the processing chamber at apressure of at least 10 atm.
 9. The system of claim 8, wherein the pumpdevice is configured to maintain the processing chamber at a pressurebetween about 10 atm and 20 atm.
 10. The system of claim 8, wherein theat least one of the processing chambers further comprises: a temperaturecontrol device configured to control a temperature of the chamber body.11. The system of claim 10, wherein the temperature control device is acooling channel formed in the chamber body, the cooling channelconfigured to flow a heating transfer fluid through the chamber body.12. The system of claim 8, wherein the at least one of the processingchambers further comprises: a single chamber door located at an end ofthe processing chamber, configured to provide ingress and egress for thesubstrate support device.
 13. The system of claim 8, wherein the gasinjection assembly supplies the NH3 gas to an interior volume of thequartz envelope.
 14. The system of claim 8, wherein the one or moresubstrates include a silicon dioxide (SiO2) layer formed thereon.
 15. Amethod of forming a semiconductor structure, comprising: forming anoxide layer on a surface of a substrate; forming a via in the oxidelayer, the via extending at least partially into the oxide layer;exposing the oxide layer to NH₃; and maintaining a chamber pressure ofat least 10 atm while exposing the oxide layer to NH₃.
 16. The method ofclaim 15, wherein the chamber pressure is maintained between about 10atm and 20 atm.
 17. The method of claim 15, wherein the chamber ismaintained between about 1000 degrees C.
 18. The method of claim 15,wherein the NH₃ is configured to travel from a top of the via to abottom of the via.
 19. The method of claim 15, wherein the NH₃ isprovided to the oxide layer at a flow rate between 1 sLm to 20 sLm. 20.The method of claim 15, wherein the oxide layer is formed from SiO₂.